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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11027856 B1

PDFFull Text
Date of Patent:
Jun. 08, 2021

Filed:

Nov. 29, 2016

Surfacing materials for composite structures

Applicant:

Cytec Industries Inc., Princeton, NJ (US);

Inventors:

Junjie Jeffrey Sang, Newark, DE (US);

Dalip Kumar Kohli, Churchville, MD (US);

Kevin R. Mullery, Newark, DE (US);

Assignee:

CYTEC INDUSTRIES INC., Princeton, NJ (US);

Attorney:

Thi Dang

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05B 3/00 (2006.01); H05B 3/16 (2006.01); B32B 5/02 (2006.01); B32B 5/12 (2006.01); B32B 5/18 (2006.01); B32B 5/26 (2006.01); B32B 27/04 (2006.01); B32B 27/10 (2006.01); B32B 27/12 (2006.01); B64D 45/02 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/36 (2006.01); B32B 15/09 (2006.01); B32B 7/12 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 21/08 (2006.01); B32B 15/088 (2006.01); B32B 27/18 (2006.01); B32B 29/02 (2006.01); B32B 5/24 (2006.01); B32B 3/26 (2006.01); B32B 27/34 (2006.01); B32B 27/06 (2006.01); B32B 15/14 (2006.01); B32B 3/12 (2006.01); B32B 21/10 (2006.01); B32B 27/26 (2006.01); B64C 1/12 (2006.01); B64C 3/20 (2006.01);
U.S. Cl.
CPC ...
B64D 45/02 (2013.01); B32B 3/12 (2013.01); B32B 3/266 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/18 (2013.01); B32B 5/245 (2013.01); B32B 5/26 (2013.01); B32B 7/12 (2013.01); B32B 9/007 (2013.01); B32B 9/045 (2013.01); B32B 9/047 (2013.01); B32B 15/08 (2013.01); B32B 15/088 (2013.01); B32B 15/09 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 21/08 (2013.01); B32B 21/10 (2013.01); B32B 27/065 (2013.01); B32B 27/10 (2013.01); B32B 27/12 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/26 (2013.01); B32B 27/281 (2013.01); B32B 27/285 (2013.01); B32B 27/286 (2013.01); B32B 27/288 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 29/02 (2013.01); B64C 1/12 (2013.01); B64C 3/20 (2013.01); B32B 2250/04 (2013.01); B32B 2255/02 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0261 (2013.01); B32B 2262/0276 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); B32B 2264/10 (2013.01); B32B 2264/102 (2013.01); B32B 2264/107 (2013.01); B32B 2264/108 (2013.01); B32B 2307/202 (2013.01); B32B 2307/4026 (2013.01); B32B 2307/54 (2013.01); B32B 2307/718 (2013.01); B32B 2307/7265 (2013.01); B32B 2307/732 (2013.01); B32B 2571/00 (2013.01); B32B 2605/18 (2013.01);
Abstract

Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.

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