The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Nov. 27, 2019
Applicant:

Takashi Kinokuni, Tokyo, JP;

Inventor:

Takashi Kinokuni, Tokyo, JP;

Assignee:

RICOH COMPANY, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14201 (2013.01); B41J 2/1623 (2013.01); B41J 2202/20 (2013.01);
Abstract

A bonding structure includes a first part including a first bonding surface and a second part including a second bonding surface to be bonded to the first bonding surface of the first part with a first adhesive and a second adhesive different from the first adhesive. At least one of the first bonding surface and the second bonding surface includes a first region on which the first adhesive is applied, a second region on which the second adhesive is applied, and a third region disposed between the first region and the second region, the third region having a water repellency higher than a water repellency of each of the first region and the second region.


Find Patent Forward Citations

Kinokuni, Takashi. (2021). Bonding structure, head module, head device, and liquid discharge apparatus (U.S. Patent No. 11027549). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11027549

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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