The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2021
Filed:
Jun. 30, 2020
Mitsubishi Aluminum Co., Ltd., Minato-ku, JP;
Denso Corporation, Kariya, JP;
Yoshiki Mori, Kitamoto, JP;
Hideyuki Miyake, Susono, JP;
Michihide Yoshino, Susono, JP;
Shohei Iwao, Susono, JP;
Masakazu Edo, Susono, JP;
Naoki Sugimoto, Anjo, JP;
Nobuhiro Honma, Chita-gun, JP;
Shogo Yamada, Nagoya, JP;
Hayaki Teramoto, Okazaki, JP;
Taketoshi Toyama, Anjo, JP;
Mitsubishi Aluminum Co., Ltd., Minato-ku, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
An aluminum alloy clad material includes: a sacrificial material on one surface of a core material; and an Al—Si—Mg—Bi-based brazing material disposed on other surface of the core material, contains, by mass %, Si: 6.0% to 14.0%, Mg: 0.05% to 1.5%, Bi: 0.05% to 0.25%, Sr: 0.0001% to 0.1%, and a balance consisting of Al and inevitable impurities, and satisfies a relationship of (Bi+Mg)×Sr≤0.1 by mass %, in which Mg—Bi-based compounds contained in the Al—Si—Mg—Bi-based brazing material with a diameter of 0.1 μm or more and less than 5.0 μm are more than 20 in number per 10,000-μmand the Mg—Bi-based compounds with a diameter of 5.0 μm or more are less than 2 in number, and the core material contains Mn: 0.9% to 1.7%, Si: 0.2% to 1.0%, Fe: 0.1% to 0.5%, Cu: 0.08% to 1.0%, and a balance consisting of Al and inevitable impurities.