The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Oct. 28, 2019
Applicant:

Tessy Plastics Corporation, Elbridge, NY (US);

Inventor:

David Young, Syracuse, NY (US);

Assignee:

Tessy Plastics Corporation, Elbridge, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/00 (2006.01); A61J 7/00 (2006.01); A61J 1/18 (2006.01); B65D 41/56 (2006.01); B65D 51/18 (2006.01); B29C 45/16 (2006.01);
U.S. Cl.
CPC ...
A61J 7/0046 (2013.01); A61J 1/18 (2013.01); B29C 45/0081 (2013.01); B29C 45/164 (2013.01); B29C 45/1657 (2013.01); B65D 41/56 (2013.01); B65D 51/18 (2013.01); B65D 2251/0015 (2013.01); B65D 2251/0078 (2013.01);
Abstract

A method of forming a cap assembly comprises injection molding a cap in a first shot from a first polymeric material, wherein the cap has an opening at one end defined by a perimeter. Injection molding a tamper band in a second shot from a second polymeric material such that the tamper band is monolithically attached to the perimeter of the cap. The first polymeric material and the second polymeric material comprise dissimilar resins and the tamper band is configured to sever from the cap with no burrs remaining on the perimeter of the cap.


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