The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Aug. 27, 2019
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Rie Maeda, Katsuura-gun, JP;

Masaaki Katsumata, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/38 (2006.01); H05K 3/12 (2006.01); H05K 3/40 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/381 (2013.01); H05K 1/0296 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 3/0029 (2013.01); H05K 3/0032 (2013.01); H05K 3/1258 (2013.01); H05K 3/1283 (2013.01); H05K 3/4061 (2013.01); H05K 3/4069 (2013.01); H05K 2203/0353 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1476 (2013.01);
Abstract

A wiring board manufacturing method includes: forming a first groove structure in a first principal surface of a base by scanning with laser light in a first irradiation pattern such that the first groove structure has a first width; irradiating an inside of the first groove structure with laser light in a second irradiation pattern that is different from the first irradiation pattern to form recessed portions inside the first groove structure; and forming a first wiring pattern by filling the first groove structure with a first electrically-conductive material to form a first wiring pattern whose shape matches with a shape of the first groove structure in a top view.


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