The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Nov. 22, 2016
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Takanobu Kajihara, Tokyo, JP;

Katsuhiko Omae, Tokyo, JP;

Shunsuke Fushie, Tokyo, JP;

Tokiyoshi Tanigawa, Tokyo, JP;

Hiroyuki Miyanishi, Tokyo, JP;

Atsuki Fujita, Tokyo, JP;

Tomohiro Inoue, Tokyo, JP;

Yuki Okabe, Tokyo, JP;

Junya Suzuki, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02K 9/22 (2006.01); H02K 11/33 (2016.01); H02K 7/116 (2006.01); B62D 5/04 (2006.01); H02K 11/00 (2016.01); H02K 9/02 (2006.01); H02K 9/00 (2006.01); H02K 9/04 (2006.01); H02K 9/24 (2006.01);
U.S. Cl.
CPC ...
H02K 9/22 (2013.01); H02K 7/116 (2013.01); H02K 11/33 (2016.01); B62D 5/04 (2013.01); H02K 9/00 (2013.01); H02K 9/02 (2013.01); H02K 9/04 (2013.01); H02K 9/24 (2013.01); H02K 11/00 (2013.01); H02K 2211/03 (2013.01);
Abstract

In a rotary electric machine in which a controller and a heat sink are arranged in an extending direction of an output shaft of a motor, in order to provide a rotary electric machine which secures a heat rejection performance and an insulation performance of a semiconductor device to be mounted to the controller and is downsized as a whole, the controller includes a semiconductor device having a drive circuit provided so as to correspond to a stator winding of the motor, and the semiconductor device has a main face held in close contact with the heat sink. On a close contact face between the semiconductor device and the heat sink, a drive circuit is formed so as to extend along an outer edge portion of the heat sink to increase a cooling area.


Find Patent Forward Citations

Loading…