The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Feb. 18, 2016
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Junji Sato, Tokyo, JP;

Ryosuke Shiozaki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); G01S 7/03 (2006.01); H01L 23/66 (2006.01); H01Q 21/08 (2006.01); H01Q 23/00 (2006.01); G01S 7/02 (2006.01); H01Q 9/04 (2006.01); G01S 7/40 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); G01S 7/02 (2013.01); G01S 7/032 (2013.01); G01S 7/4026 (2013.01); H01L 23/66 (2013.01); H01Q 9/04 (2013.01); H01Q 21/08 (2013.01); H01Q 23/00 (2013.01); G01S 2007/028 (2013.01); G01S 2007/4013 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1421 (2013.01); H01Q 1/2283 (2013.01);
Abstract

An antenna-integrated module includes: one or more semiconductor chips each including a silicon substrate, a metal layer stacked on a first surface of the silicon substrate, and one or more frequency converters; an insulating layer that surrounds the one or more semiconductor chips; a re-distribution layer that is stacked on a first surface of the insulating layer and on a first surface of the metal layer; one or more first antenna elements that are provided on the first surface of the metal layer with a first conductor pattern and that are connected to the one or more frequency converters; and one or more second antenna elements that are provided with a second conductor pattern on a first surface of the re-distribution layer stacked on the first surface of the insulating layer and that are connected to the one or more frequency converters.


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