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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11024832 B1

PDFFull Text
Date of Patent:
Jun. 01, 2021

Filed:

Sep. 28, 2015

Packaging material for cell

Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Youhei Hashimoto, Tokyo, JP;

Rikiya Yamashita, Tokyo, JP;

Shunsuke Ueda, Tokyo, JP;

Assignee:

DAI NIPPON PRINTING CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Zachary M Davis

Int. Cl.
CPC ...
B32B 27/32 (2006.01); H01M 2/02 (2006.01); B65D 65/40 (2006.01); B32B 7/02 (2019.01); B32B 27/20 (2006.01); B32B 15/088 (2006.01); B32B 27/28 (2006.01); B32B 27/36 (2006.01); B32B 7/12 (2006.01); B32B 23/04 (2006.01); B32B 15/092 (2006.01); B32B 15/18 (2006.01); B32B 7/04 (2019.01); B32B 15/085 (2006.01); B32B 15/095 (2006.01); B32B 25/20 (2006.01); B32B 15/082 (2006.01); B32B 27/30 (2006.01); B32B 27/08 (2006.01); B32B 27/34 (2006.01); B32B 25/18 (2006.01); B32B 15/20 (2006.01); B32B 27/42 (2006.01); B32B 25/16 (2006.01); B32B 27/40 (2006.01); B32B 27/38 (2006.01); B32B 15/09 (2006.01); B32B 15/06 (2006.01); B32B 15/098 (2006.01); B32B 25/14 (2006.01);
U.S. Cl.
CPC ...
H01M 2/0287 (2013.01); B32B 7/02 (2013.01); B32B 7/04 (2013.01); B32B 7/12 (2013.01); B32B 15/06 (2013.01); B32B 15/082 (2013.01); B32B 15/085 (2013.01); B32B 15/088 (2013.01); B32B 15/09 (2013.01); B32B 15/092 (2013.01); B32B 15/095 (2013.01); B32B 15/098 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 23/042 (2013.01); B32B 25/14 (2013.01); B32B 25/16 (2013.01); B32B 25/18 (2013.01); B32B 25/20 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/281 (2013.01); B32B 27/285 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/322 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 27/38 (2013.01); B32B 27/40 (2013.01); B32B 27/42 (2013.01); B65D 65/40 (2013.01); H01M 2/0277 (2013.01); H01M 2/0285 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2270/00 (2013.01); B32B 2307/206 (2013.01); B32B 2307/302 (2013.01); B32B 2307/31 (2013.01); B32B 2307/50 (2013.01); B32B 2307/71 (2013.01); B32B 2307/714 (2013.01); B32B 2307/7244 (2013.01); B32B 2307/7246 (2013.01); B32B 2307/732 (2013.01); B32B 2307/746 (2013.01); B32B 2307/752 (2013.01); B32B 2457/10 (2013.01); B32B 2457/16 (2013.01); B32B 2553/00 (2013.01);
Abstract

A film-shaped packaging material for a cell in which a coating layer is provided as the outermost layer instead of a substrate layer and an adhesive layer in a conventional film-shaped packaging material for a cell, thereby making it possible to produce a thinner film; wherein the packaging material is provided with exceptional moldability and insulation performance and enables lead time to be reduced. The packaging material is a laminate having at least a coating layer, a barrier layer, and a sealant layer in the stated order, the coating layer including a single- or multiple-layer configuration formed by a cured product of a resin composition containing a heat-curable resin and curing accelerator, the laminate having a piercing strength of at least 5 N, as measured in compliance with JIS 1707:1997, and the coating layer having a breakdown voltage of at least 1.0 kV, as measured in compliance with JIS C2110-1.

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