The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11024789 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 01, 2021

Filed:

Dec. 19, 2019
Applicant:

Sridhar Kasichainula, Fremont, CA (US);

Inventor:

Sridhar Kasichainula, Fremont, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/32 (2006.01); H01L 35/08 (2006.01);
U.S. Cl.
CPC ...
H01L 35/32 (2013.01); H01L 35/08 (2013.01);
Abstract

A thin-film based thermoelectric module includes a flexible substrate having a dimensional thickness less than or equal to 25 μm, and a number of pairs of N-type and P-type thermoelectric legs electrically in contact with one another on the flexible substrate. The thin-film based thermoelectric module also includes a number of conductive interconnects on top of the number of pairs of the N-type and the P-type thermoelectric legs, and an elastomer encapsulating the flexible substrate, the number of pairs of the N-type and the P-type thermoelectric legs and the number of conductive interconnects to render flexibility to the thin-film based thermoelectric module such that an array of equivalent thin-film based thermoelectric modules is completely wrappable and bendable around a system element from which the array is configured to derive thermoelectric power. The thin-film based thermoelectric module is less than or equal to 100 μm in dimensional thickness.


Find Patent Forward Citations

Loading…