The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Aug. 31, 2018
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Roshan Murthy, Raleigh, NC (US);

Kenneth M. Davis, Raleigh, NC (US);

Jae-Hyung Park, Cary, NC (US);

Xiameng Shi, Cary, NC (US);

Assignee:

CreeLED, Inc., Newark, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 25/16 (2006.01); H01L 33/64 (2010.01); H01L 21/66 (2006.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01); H01L 27/02 (2006.01); G02B 5/02 (2006.01); G02B 27/09 (2006.01); H01L 23/00 (2006.01); H01L 33/10 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); G02B 5/0205 (2013.01); G02B 27/0955 (2013.01); H01L 22/32 (2013.01); H01L 24/04 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 27/0248 (2013.01); H01L 33/10 (2013.01); H01L 33/502 (2013.01); H01L 33/60 (2013.01); H01L 33/647 (2013.01);
Abstract

Solid state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. In some embodiments, an LED package includes electrical connections that are configured to reduce corrosion of metals within the LED package; or decrease the overall forward voltage of the LED package; or provide an electrical path for serially-connected electrostatic discharge (ESD) chips. In some embodiments, an LED package includes at least two LED chips and a material between the two LED chips that promotes homogeneity of composite emissions from the two LED chips. In this manner, LED packages according to the present disclosure may be beneficial for various applications, including those where a high luminous intensity is desired in a variety of environmental conditions. Such applications include automotive lighting, aerospace lighting, and general illumination.


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