The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Nov. 21, 2019
Applicant:
Cyntec Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
CYNTEC CO., LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H05K 1/11 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01L 23/31 (2013.01); H01L 23/53228 (2013.01); H01L 24/14 (2013.01); H01L 25/0657 (2013.01); H05K 1/11 (2013.01);
Abstract
A stacked electronic structure comprises: a substrate and a magnetic device, wherein electronic devices and conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the electronic devices, and the magnetic device is disposed over and electrically connected to the conductive pillars, wherein at least one recess or groove can be formed on the bottom surface of the conductive pillar, such as copper pillar, to help the venting of the soldering material as well as to increase the soldering area.