The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Sep. 10, 2018
Toshiba Memory Corporation, Minato-ku, JP;
TOSHIBA MEMORY CORPORATION, Minato-ku, JP;
Abstract
A semiconductor manufacturing apparatus that sequentially stacks a plurality of semiconductor chips while aligning the plurality of semiconductor chips on a stage. A condition determinator determines whether an apparatus performing a mounting processing stops during a mounting processing of the plurality of semiconductor chips. An evacuation controller evacuates, when it is determined that the apparatus performing the mounting processing stops, a group of semiconductor chips that has been stacked before the determination. A resuming determinator determines whether to resume the mounting processing after it is determined that the predetermined condition is satisfied. A return controller returns the evacuated group of semiconductor chips to a position before the evacuation and continues the mounting processing when it is determined that the mounting processing is resumed.