The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Sep. 10, 2019
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Seung-hee Go, Seongnam-si, KR;

Min-hee Uh, Gwacheon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/10 (2006.01); H01L 23/00 (2006.01); G09G 3/20 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); G09G 3/20 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/32 (2013.01); G09G 2310/0267 (2013.01); G09G 2310/0275 (2013.01); G09G 2330/028 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/32145 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/1426 (2013.01);
Abstract

A display driver integrated circuit (IC) device includes a first substrate having a first front surface and a first back surface; a first interlayer insulating layer on the first front surface; a wiring layer in the first interlayer insulating layer; a first bonding insulating layer on the first interlayer insulating layer; a second substrate having a second front surface and a second back surface, the second front surface being disposed toward the first front surface; a second interlayer insulating layer on the second front surface a second bonding insulating layer on the second interlayer insulating layer and physically bonded to the first bonding insulating layer; and a back via stack structure penetrating the second substrate, the second interlayer insulating layer, the second bonding insulating layer, the first bonding insulating layer, and the first interlayer insulating layer and electrically connected to the wiring layer.


Find Patent Forward Citations

Loading…