The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Nov. 06, 2019
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

David Suich, Durham, NC (US);

Arthur F. Pun, Raleigh, NC (US);

Colin Blakely, Raleigh, NC (US);

Assignee:

CreeLED, Inc., Newark, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 33/26 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/26 (2013.01); H01L 33/62 (2013.01);
Abstract

Lumiphoric material region arrangements are provided for light-emitting diode (LED) packages. Certain aspects relate to arrangements of light-altering materials and lumiphoric material regions for LED packages. Lumiphoric material regions over corresponding LED chips may include increased sizes relative to overall LED package dimensions. Lumiphoric material regions may be arranged to extend to certain peripheral edges of an LED package. Multiple lumiphoric material regions and corresponding LED chips may be arranged in close proximity to one another to provide LED packages with multiple and selectable illumination characteristics. Light-altering materials may be arranged that at least partially define certain peripheral edges of lumiphoric material regions. The light-altering materials may form one or more nonintersecting segments arranged about the lumiphoric material regions. Certain aspects relate to LED packages having one or more of reduced sizes, increased light output, and reduced fabrication steps.


Find Patent Forward Citations

Loading…