The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Jun. 09, 2017
Applicant:
Goertek, Inc., Weifang, CN;
Inventors:
Quanbo Zou, Weifang, CN;
Peixuan Chen, Weifeng, CN;
Xiangxu Feng, Weifang, CN;
Tao Gan, Weifang, CN;
Xiaoyang Zhang, Weifang, CN;
Zhe Wang, Weifang, CN;
Assignee:
Goertek, Inc., Weifang, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 25/075 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 33/00 (2010.01); H01L 51/00 (2006.01); H01L 21/683 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 21/67144 (2013.01); H01L 21/67712 (2013.01); H01L 21/67721 (2013.01); H01L 27/1266 (2013.01); H01L 33/0095 (2013.01); H01L 21/6835 (2013.01); H01L 33/0093 (2020.05); H01L 51/003 (2013.01); H01L 2021/6006 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01);
Abstract
A micro-LED transfer method, manufacturing method and display device are provided. The micro-LED transfer method comprises: bonding the micro-LED array on a first substrate onto a receiving substrate through micro-bumps, wherein the first substrate is laser transparent; applying underfill into a gap between the first substrate and the receiving substrate; irradiating laser onto the micro-LED array from a side of the first substrate to lift-off the micro-LED array from the first substrate; and removing the underfill.