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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11024608 B1

PDFFull Text
Date of Patent:
Jun. 01, 2021

Filed:

Jul. 18, 2018

Structures and methods for electrical connection of micro-devices and substrates

Applicant:

X Display Company Technology Limited, Dublin, IE;

Inventors:

Matthew Meitl, Durham, NC (US);

Brook Raymond, Cary, NC (US);

Ronald S. Cok, Rochester, NY (US);

Christopher Andrew Bower, Raleigh, NC (US);

Salvatore Bonafede, Chapel Hill, NC (US);

Erich Radauscher, Raleigh, NC (US);

Carl Ray Prevatte, Jr., Raleigh, NC (US);

António José Marques Trindade, Cork, IE;

Tanya Yvette Moore, Hurdle Mills, NC (US);

Assignee:

X Display Company Technology Limited, Dublin, IE;

Attorneys:

Michael D. Schmitt

William R. Haulbrook

Choate, Hall & Stewart LLP

Primary Examiner:

David Sample

Assistant Examiner:

Donald M Flores, Jr

Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 21/683 (2006.01); H01L 25/00 (2006.01); H01L 25/04 (2014.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 21/6835 (2013.01); H01L 33/62 (2013.01); H01L 25/041 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 33/0093 (2020.05); H01L 33/0095 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An exemplary micro-device and substrate structure includes a destination substrate and one or more contact pads disposed thereon, a micro-device disposed on or over the destination substrate, and a layer of cured adhesive disposed on the destination substrate. The micro-device comprises at least one electrical contact. The at least one electrical contact is in direct electrical contact with the one or more contact pads. The adhesive layer adheres the micro-device to the destination substrate and is in contact with the one or more contact pads. An exemplary method of making a micro-device and substrate structure includes providing a destination substrate and one or more contact pads disposed thereon, coating a layer of curable adhesive, disposing a micro-device comprising at least one electrical contact on the layer and curing the layer thereby directly electrically contacting the at least one electrical contact with the one or more contact pads.

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