logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11024571 B1

PDFFull Text
Date of Patent:
Jun. 01, 2021

Filed:

Mar. 22, 2019

Coil built-in multilayer substrate and power supply module

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Keito Yonemori, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Alia Sabur

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01F 27/32 (2006.01); H01F 27/28 (2006.01); H05K 1/16 (2006.01); H01F 27/29 (2006.01); H01F 17/00 (2006.01); H02M 3/04 (2006.01); H05K 3/46 (2006.01); H02M 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01F 17/0013 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/323 (2013.01); H01L 23/49822 (2013.01); H02M 3/00 (2013.01); H02M 3/04 (2013.01); H05K 1/16 (2013.01); H05K 3/46 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A coil built-in multilayer substrate includes a multilayer substrate, a coil, interlayer connection conductors, and gaps. The multilayer substrate includes a magnetic layer, a component-mounting land conductor provided on a first principal surface, and a terminal conductor provided on a second principal surface. The coil is provided in the magnetic layer and includes an axis extending in a direction perpendicular or substantially perpendicular to the first and second principal surfaces. The interlayer connection conductors are provided in the magnetic layer in a region inside the spiral coil. Gaps penetrate lateral surfaces of the interlayer connection conductors.

Find Patent Forward Citations

Quick Actions:

Yonemori, Keito. (2021). Coil built-in multilayer substrate and power supply module (U.S. Patent No. 11024571). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11024571

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…