The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Apr. 12, 2019
Infineon Technologies Ag, Neubiberg, DE;
Jochen Dangelmaier, Beratzhausen, DE;
Kim Huat Hoa, Melaka, MY;
Hazrul Alang Abd Hamid, Sembilan, MY;
Andreas Allmeier, Pfatter, DE;
Dietmar Lang, Regenstauf, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor device includes a die paddle, a plurality of electrically conductive leads extending away from the die paddle, and an adhesion promoter plating material selectively formed on the electrically conductive leads such that outer portions of the leads are covered by the adhesion promoter plating material, and interior portions of the leads that are disposed between the die paddle and the respective outer portions of each lead are substantially devoid of the adhesion promoter plating material.