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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11024488 B1

PDFFull Text
Date of Patent:
Jun. 01, 2021

Filed:

Oct. 31, 2017

Film-forming method, manufacturing method of electronic device, and plasma atomic layer deposition apparatus

Applicant:

The Japan Steel Works, Ltd., Tokyo, JP;

Inventors:

Keisuke Washio, Kanagawa, JP;

Masao Nakata, Kanagawa, JP;

Tatsuya Matsumoto, Kanagawa, JP;

Junichi Shida, Kanagawa, JP;

Assignee:

THE JAPAN STEEL WORKS, LTD., Tokyo, JP;

Attorney:

SGPatents PLLC

Primary Examiner:

Jarrett J Stark

Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01J 37/32 (2006.01); C23C 16/04 (2006.01); C23C 16/455 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); C23C 16/40 (2006.01); H01L 21/31 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32669 (2013.01); C23C 16/042 (2013.01); C23C 16/403 (2013.01); C23C 16/45542 (2013.01); C23C 16/45544 (2013.01); H01J 37/32743 (2013.01); H01L 21/02642 (2013.01); H01L 21/31 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); H01J 37/32834 (2013.01); H01J 2237/332 (2013.01);
Abstract

In a film-forming technology using charged particles, a disturbance in film thickness distribution caused by leakage magnetic field is suppressed. A film-forming method embodies a technological idea of switching generation and stop of a magnetic field during a film-forming operation so as to stop the generation of the magnetic field during a period when plasma is generated and generate the magnetic field during a period when plasma is not generated.

Find Patent Forward Citations

Washio, Keisuke. (2021). Film-forming method, manufacturing method of electronic device, and plasma atomic layer deposition apparatus (U.S. Patent No. 11024488). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11024488

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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