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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11024439 B1

PDFFull Text
Date of Patent:
Jun. 01, 2021

Filed:

Nov. 18, 2016

Particles, connecting material and connection structure

Applicant:

Sekisui Chemical Co., Ltd., Osaka, JP;

Inventors:

Mai Yamagami, Osaka, JP;

Satoshi Haneda, Osaka, JP;

Takeshi Wakiya, Osaka, JP;

Yasuyuki Yamada, Shiga, JP;

Saori Ueda, Shiga, JP;

Masao Sasadaira, Shiga, JP;

Assignee:

SEKISUI CHEMICAL CO., LTD., Osaka, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Alexandre F Ferre

Int. Cl.
CPC ...
B23K 35/36 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); C08F 216/06 (2006.01); C08F 212/36 (2006.01); C08F 36/20 (2006.01); C09J 9/02 (2006.01); H01B 1/22 (2006.01); B22F 7/08 (2006.01); C08F 30/08 (2006.01); C08F 36/08 (2006.01); H01R 11/01 (2006.01); C08F 16/32 (2006.01); H01B 5/00 (2006.01); C09J 201/00 (2006.01); B23K 35/26 (2006.01); B22F 7/06 (2006.01); B22F 1/02 (2006.01); B23K 35/24 (2006.01); C08F 12/36 (2006.01); C09J 11/08 (2006.01); C08F 16/20 (2006.01); C08G 61/02 (2006.01); H01L 23/00 (2006.01); B22F 1/00 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); B22F 1/025 (2013.01); B22F 7/064 (2013.01); B22F 7/08 (2013.01); B23K 35/025 (2013.01); B23K 35/24 (2013.01); B23K 35/262 (2013.01); B23K 35/302 (2013.01); B23K 35/3006 (2013.01); B23K 35/3013 (2013.01); B23K 35/3033 (2013.01); B23K 35/3613 (2013.01); C08F 12/36 (2013.01); C08F 16/20 (2013.01); C08F 16/32 (2013.01); C08F 30/08 (2013.01); C08F 36/08 (2013.01); C08G 61/02 (2013.01); C09J 9/02 (2013.01); C09J 11/08 (2013.01); C09J 201/00 (2013.01); H01B 5/00 (2013.01); H01L 24/29 (2013.01); H01R 11/01 (2013.01); B22F 1/0011 (2013.01); B22F 1/0059 (2013.01); B22F 2301/10 (2013.01); B22F 2301/15 (2013.01); B22F 2301/255 (2013.01); B22F 2301/30 (2013.01); B22F 2304/10 (2013.01); B23K 35/0244 (2013.01); C08G 2261/3142 (2013.01); C08G 2261/3321 (2013.01); H01L 2224/29391 (2013.01); H01L 2224/29411 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29444 (2013.01); H01L 2224/29447 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/29499 (2013.01); H01L 2924/0635 (2013.01); H01L 2924/35121 (2013.01);
Abstract

Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part, and can increase the connection strength are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 μm or more and 300 μm or less, the particles have a 10% K value of 30 N/mmor more and 3000 N/mmor less, and the particles have a particle diameter CV value of 10% or less.

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