The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Apr. 01, 2019
Applicant:
Thermal Corp., Wilmington, DE (US);
Inventors:
David Sarraf, Elizabethtown, PA (US);
John Hartenstine, Mountville, PA (US);
Jerome Toth, Exton, PA (US);
Scott Garner, Lititz, PA (US);
Assignee:
Aavid Thermal Corp., Wilmington, DE (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); F28D 15/04 (2006.01); F28D 15/02 (2006.01); H01L 23/427 (2006.01); F28F 1/00 (2006.01); F28F 1/24 (2006.01); F28F 21/08 (2006.01); F28F 21/02 (2006.01);
U.S. Cl.
CPC ...
F28D 15/04 (2013.01); F28D 15/02 (2013.01); F28D 15/0275 (2013.01); F28D 15/0283 (2013.01); F28F 1/003 (2013.01); F28F 1/24 (2013.01); F28F 21/081 (2013.01); F28F 21/085 (2013.01); H01L 23/427 (2013.01); F28F 21/02 (2013.01); F28F 2220/00 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/3011 (2013.01);
Abstract
Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.