The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Oct. 31, 2018
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); C25D 7/06 (2006.01); H01B 1/04 (2006.01); H05K 3/18 (2006.01); H05K 1/09 (2006.01); C25D 15/00 (2006.01); C25D 15/02 (2006.01); H05K 1/02 (2006.01); C25D 7/12 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); C25D 7/0607 (2013.01); C25D 15/00 (2013.01); C25D 15/02 (2013.01); H01B 1/04 (2013.01); H05K 1/092 (2013.01); H05K 3/188 (2013.01); C25D 7/12 (2013.01); H05K 1/028 (2013.01); H05K 2201/0323 (2013.01); H05K 2203/0723 (2013.01);
Abstract
A plating solution including a metal salt, a hydrophilic fullerene, and water, a metal composite material including a hydrophilic fullerene and a method of manufacturing the same, and a wire, a flexible printed circuit (FPC), and an electronic device including the metal composite material.