The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Aug. 29, 2018
Applicant:

E I Du Pont DE Nemours and Company, Wilmington, DE (US);

Inventors:

Kostantinos Kourtakis, Media, PA (US);

Rosa Irene Gonzalez, Pearland, TX (US);

Herbert W Lim, Columbus, OH (US);

Assignee:

E I DU PONT DE NEMOURS AND COMPANY, Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/08 (2006.01); C08J 5/12 (2006.01); H05K 1/03 (2006.01); C08J 5/18 (2006.01); B32B 15/20 (2006.01); B32B 27/28 (2006.01); H05K 3/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); B32B 15/20 (2013.01); B32B 27/281 (2013.01); C08J 5/12 (2013.01); C08J 5/18 (2013.01); H05K 1/036 (2013.01); H05K 1/0393 (2013.01); B32B 2250/03 (2013.01); B32B 2250/04 (2013.01); B32B 2250/05 (2013.01); B32B 2307/412 (2013.01); B32B 2457/08 (2013.01); C08J 2379/08 (2013.01); C08J 2479/08 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); H05K 3/0014 (2013.01); H05K 3/022 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/068 (2013.01);
Abstract

In a first aspect, a multilayer film includes a first outer layer including a first thermoplastic polyimide, a core layer including a polyimide, and a second outer layer including a second thermoplastic polyimide. The polyimide of the core layer includes a first aromatic dianhydride including 3,3',4,4′-biphenyl tetracarboxylic dianhydride and a first aromatic diamine including p-phenylenediamine. The multilayer film has a total thickness in a range of from 5 to 150 μm. A thickness of the core layer is in a range of from 35 to 73% of the total thickness of the multilayer film. A minimum peel strength for at least one of the first and second outer layers, when adhered to copper foil and tested following ASTM method IPC-TM-650, method No. 2.4.9B, is greater than 0.9 kgf/cm (0.88 N/mm). In a second aspect, a metal-clad laminate includes the multilayer film of the first aspect and a first metal layer adhered to an outer surface of the first outer layer of the multilayer film.


Find Patent Forward Citations

Kourtakis, Kostantinos. (2021). Multilayer film for electronic circuitry applications (U.S. Patent No. 11021606). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11021606

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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