The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Jan. 30, 2015
Daikin Industries, Ltd., Osaka, JP;
Daikin America, Inc., Orangeburg, NY (US);
Tadaharu Isaka, Settsu, JP;
Ryouichi Fukagawa, Settsu, JP;
Takeshi Shimono, Settsu, JP;
Keizou Shiotsuki, Settsu, JP;
DAIKIN INDUSTRIES, LTD., Osaka, JP;
DAIKIN AMERICA, INC., Orangeburg, NY (US);
Abstract
Provided is a tetrafluoroethylene/hexafluoropropylene copolymer which is less likely to form a lump, or is less likely to form a large lump even if a lump is formed, during the formation of an electric wire. The tetrafluoroethylene/hexafluoropropylene copolymer has a melt flow rate measured at 372° C. of 35.0 to 45.0 g/10 minutes and a swell of −8.0% to 5.0%, the sum of the numbers of —CFH groups and unstable end groups being 120 or less per 1×10carbon atoms.