The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Nov. 10, 2017
Daicel Corporation, Osaka, JP;
Fei Yang, Shanghai, CN;
Yoshimichi Okano, Himeji, JP;
Kouji Nakatani, Himeji, JP;
Feng Liu, Shanghai, CN;
Michiyo Nakai, Himeji, JP;
Takayuki Yaegashi, Himeji, JP;
Yusuke Okamoto, Himeji, JP;
Tsukasa Yoshida, Himeji, JP;
DAICEL CORPORATION, Osaka, JP;
Abstract
There is provided a curable compound having good solvent solubility and being capable of forming a cured material having super heat resistance. The curable compound according to the present invention is represented by the following formula (1). In the formula (1), Rand Reach represent a curable functional group; Dand Deach represent a single bond or a linking group; and L represents a divalent group having a repeating unit containing a structure represented by the following formula (I) and a structure represented by the following formula (II) (wherein Arto Areach represent a group made by eliminating two hydrogen atoms from a structural formula of an aromatic ring or a group made by eliminating two hydrogen atoms from a structural formula in which two or more aromatic rings are bound through a single bond or a linking group; X represents —CO—, —S— or —SO—; each Y represents —S—, —SO—, —O—, —CO—, —COO— or —CONH—; and n represents an integer of 0 or more):