The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Feb. 16, 2017
Applicant:
Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;
Inventors:
Kai Herbst, Erlangen, DE;
Christian Muschelknautz, Darmstadt, DE;
Assignee:
HERAEUS DEUTSCHLAND GMBH & CO. KG, Hanau, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C04B 37/02 (2006.01); H05K 3/24 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
C04B 37/021 (2013.01); H05K 3/245 (2013.01); H05K 3/4623 (2013.01); C04B 2235/78 (2013.01); C04B 2235/781 (2013.01); C04B 2235/782 (2013.01); C04B 2235/784 (2013.01); C04B 2235/785 (2013.01); C04B 2235/786 (2013.01); C04B 2237/34 (2013.01); C04B 2237/343 (2013.01); C04B 2237/36 (2013.01); C04B 2237/407 (2013.01); C04B 2237/704 (2013.01); C04B 2237/706 (2013.01);
Abstract
The invention relates to a copper-ceramic composite comprising: a ceramic substrate; and a copper or copper alloy coating on the ceramic substrate, the copper or copper alloy having grain sizes of 10 μm to 300 μm.