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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11020945 B1

PDFFull Text
Date of Patent:
Jun. 01, 2021

Filed:

Feb. 04, 2020

Multilayer structure, and packaging material formed from the multilayer structure

Applicant:

Mitsubishi Chemical Corporation, Tokyo, JP;

Inventor:

Ryohei Komuro, Osaka, JP;

Assignee:

MITSUBISHI CHEMICAL CORPORATION, Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Zachary M Davis

Int. Cl.
CPC ...
B32B 7/02 (2019.01); B32B 27/08 (2006.01); B65D 65/40 (2006.01); B32B 27/28 (2006.01); C08L 29/04 (2006.01); C08K 5/098 (2006.01); B65D 81/24 (2006.01); B32B 27/18 (2006.01); B32B 21/08 (2006.01); B32B 27/36 (2006.01); B32B 27/10 (2006.01); B32B 29/00 (2006.01); B32B 15/08 (2006.01); B32B 5/02 (2006.01); B32B 27/34 (2006.01); B29C 48/16 (2019.01); B32B 7/12 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B65D 65/16 (2006.01); C08J 5/12 (2006.01); B29C 48/08 (2019.01); B29C 48/21 (2019.01); B29K 23/00 (2006.01); B29K 105/00 (2006.01); B29K 509/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B29C 48/16 (2019.02); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 21/08 (2013.01); B32B 27/10 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/28 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 29/002 (2013.01); B65D 65/16 (2013.01); B65D 65/40 (2013.01); B65D 81/24 (2013.01); C08J 5/124 (2013.01); C08K 5/098 (2013.01); C08L 29/04 (2013.01); B29C 48/08 (2019.02); B29C 48/21 (2019.02); B29K 2023/0625 (2013.01); B29K 2023/086 (2013.01); B29K 2105/0094 (2013.01); B29K 2509/00 (2013.01); B29K 2995/0067 (2013.01); B29L 2031/712 (2013.01); B32B 2264/104 (2013.01); B32B 2270/00 (2013.01); B32B 2307/412 (2013.01); B32B 2307/514 (2013.01); B32B 2307/7242 (2013.01); B32B 2439/70 (2013.01); B32B 2439/80 (2013.01); C08J 2323/26 (2013.01); C08J 2423/06 (2013.01); C08J 2429/04 (2013.01);
Abstract

A multilayer structure is provided, which includes a layer containing a saponified ethylene-vinyl ester copolymer, and a layer of a thermoplastic resin other than the saponified ethylene-vinyl ester copolymer provided on at least one side of the saponified ethylene-vinyl ester copolymer-containing layer with the intervention of an adhesive resin layer. An interface layer having a thickness (X) of 50 to 400 nm is present in an interface between the saponified ethylene-vinyl ester copolymer-containing layer and the adhesive resin layer. Alternatively, a viscosity increase rate in the interface between the saponified ethylene-vinyl ester copolymer-containing layer and the adhesive resin layer is 0.1% to 8%. Therefore, the multilayer structure has long-run durability, and is less liable to have poor appearance even if being produced by a multilayer coextrusion method.

Find Patent Forward Citations

Komuro, Ryohei. (2021). Multilayer structure, and packaging material formed from the multilayer structure (U.S. Patent No. 11020945). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11020945

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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