The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Sep. 12, 2014
Applicant:

Mitsui Chemicals, Inc., Tokyo, JP;

Inventors:

Hiroshi Okumura, Ichihara, JP;

Masaki Misumi, Yokohama, JP;

Shunsaku Kubota, Kishiwada, JP;

Goro Inoue, Sodegaura, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/04 (2019.01); B32B 15/085 (2006.01); B32B 27/32 (2006.01); B32B 3/26 (2006.01); B24C 1/00 (2006.01); C08J 5/12 (2006.01); B29C 45/14 (2006.01); B29K 23/00 (2006.01);
U.S. Cl.
CPC ...
B32B 7/04 (2013.01); B24C 1/00 (2013.01); B29C 45/14311 (2013.01); B32B 3/263 (2013.01); B32B 15/085 (2013.01); B32B 27/32 (2013.01); C08J 5/12 (2013.01); B29K 2023/00 (2013.01); B32B 2250/02 (2013.01);
Abstract

A metal/resin composite structure () of the invention is formed by bonding a metal member () and a resin member () to each other. A concavo-convex shape satisfying the following characteristics (i) and (ii) is formed on a bonding surface () of the metal member () to be bonded to the resin member ().


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