The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Jun. 29, 2018
The Procter & Gamble Company, Cincinnati, OH (US);
Daniel Charles Peck, Mason, OH (US);
John Brian Strube, Okeana, OH (US);
Matthew William Waldron, Hamilton, OH (US);
The Procter & Gamble Company, Cincinnati, OH (US);
Abstract
Tip bonded formed laminates, and methods for making tip bonded formed laminates, are made from multiple layers of formed substrates made from films which are bonded together at the tips of their formed protrusions. Tip bonded laminates can be designed with greater resistance to bending, improved resilience to compression, and can be patterned for directionally oriented responses to tensile loads. Also, tip bonded formed laminates made from multiple layers of formed substrates can use their layered structure to provide better aesthetics as well as better physical properties such as improved puncture resistance. Tip bonded formed laminates can be configured with thicker portions and designed patterns, which are appealing to consumers. A tip bonded formed laminate can be made from two or more formed substrates and can be used instead of a single, thick, unformed, substrate, so the laminate can use about the same amount of material, while still providing surprising functional benefits. Tip bonded formed laminates can provide these benefits without relying on more expensive polymers and/or high concentrations of additives and offer significant improvements at a reasonable cost, when compared with unformed, single layer substrates.