The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Jun. 21, 2017
Canon Kabushiki Kaisha, Tokyo, JP;
Satoshi Oikawa, Yokohama, JP;
Yukuo Yamaguchi, Tokyo, JP;
Mikiya Umeyama, Tokyo, JP;
Hiromasa Amma, Kawasaki, JP;
Takuya Iwano, Inagi, JP;
Satoshi Kimura, Kawasaki, JP;
Naoko Tsujiuchi, Kawasaki, JP;
Yasushi Iijima, Tokyo, JP;
Kyosuke Toda, Kawasaki, JP;
CANON KABUSHIKI KAISHA, Tokyo, JP;
Abstract
A resin molding method includes a first molding step, a sliding step, a second molding step and a mold opening step. In the first molding step, first molded part supported in a fixed mold and a second molded part supported in a die slide mold are molded in different positions in a second direction. In the sliding step, the movable mold is removed in a first direction and the first molded part and the second molded part are aligned by the die slide mold is moved in the second direction. In the second molding step, the movable mold is clamped again with the fixed mold and resin is injected into engaged portions. Each of the first molded part and the second molded part includes at least one wall extending in the first direction, and in the second molding step, the first molded part and the second molded part are engaged with each other at sides of the walls extending in the first direction.