The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Oct. 05, 2016
Applicant:

Kraussmaffei Technologies Gmbh, Munich, DE;

Inventors:

Martin Schneebauer, Munich, DE;

Florian Eilhardt, Munich, DE;

Bernd Klotz, Günding/Bergkirchen, DE;

Matthias Dykhuis, Munich, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29C 37/00 (2006.01); B29C 45/16 (2006.01); B29C 67/24 (2006.01); B29B 7/74 (2006.01); B29B 7/86 (2006.01); B29K 75/00 (2006.01); B29C 45/03 (2006.01);
U.S. Cl.
CPC ...
B29C 37/0028 (2013.01); B29B 7/7457 (2013.01); B29B 7/86 (2013.01); B29C 45/14 (2013.01); B29C 45/16 (2013.01); B29C 45/1628 (2013.01); B29C 45/1679 (2013.01); B29C 67/246 (2013.01); B29C 2037/0035 (2013.01); B29C 2045/033 (2013.01); B29C 2045/1632 (2013.01); B29C 2045/1685 (2013.01); B29K 2075/00 (2013.01);
Abstract

The invention relates to an injection moulding machine having a coating installation, wherein the injection moulding machine has at least one fixed platen and one movable platen for the fastening of mould tool halves of at least one mould tool, and the coating installation has first pressure-generating and/or first pressure-conducting means for coating components at a first, relatively low pressure level and second pressure-generating and/or second pressure-conducting means for the coating components at a second, relatively high pressure level, wherein at least all second pressure-generating and all second pressure-conducting means are coupled to the movable platen so as to be jointly movable along a movement path of the movable platen.


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