The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Jun. 30, 2020
Applicants:

Mitsubishi Aluminum Co., Ltd., Minato-ku, JP;

Denso Corporation, Kariya, JP;

Inventors:

Yoshiki Mori, Kitamoto, JP;

Hideyuki Miyake, Susono, JP;

Michihide Yoshino, Susono, JP;

Shohei Iwao, Susono, JP;

Masakazu Edo, Susono, JP;

Naoki Sugimoto, Anjo, JP;

Nobuhiro Honma, Chita-gun, JP;

Shogo Yamada, Nagoya, JP;

Hayaki Teramoto, Okazaki, JP;

Taketoshi Toyama, Anjo, JP;

Assignees:

Mitsubishi Aluminum Co., Ltd., Minato-ku, JP;

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/28 (2006.01); C22C 21/02 (2006.01); B23K 35/02 (2006.01); B32B 15/01 (2006.01); B23K 101/14 (2006.01);
U.S. Cl.
CPC ...
B23K 35/286 (2013.01); B23K 35/0238 (2013.01); B32B 15/016 (2013.01); C22C 21/02 (2013.01); B23K 2101/14 (2018.08);
Abstract

An Al—Si—Mg—Bi-based brazing material containing Si: 6.0% to 14.0%, Fe: 0.05% to 0.3%, Mg: 0.02% to 1.5%, Bi: 0.05% to 0.25%, Sr: 0.0001% to 0.1%, and a balance of Al and inevitable impurities, and satisfies (Bi+Mg)×Sr≤0.1, is disposed on both surfaces of a core material, Mg—Bi-based compounds of the brazing material with a diameter of 0.1 μm or more and less than 5.0 μm in terms of equivalent circle diameter are more than 20 in number in 10,000 μmand the Mg—Bi-based compounds with diameter of 5.0 μm or more are less than 2 in number in 10,000 μm, the core material contains Mn: 0.8% to 1.8%, Si: 0.01% to 1.0%, Fe: 0.1% to 0.5%, and a balance of Al and inevitable impurities, and a cathode current density of a brazing material layer after a brazing heat treatment is 0.1 mA/cmor less.


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