The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Oct. 29, 2018
Applicant:

Asti Global Inc., Taiwan, Changhua County, TW;

Inventors:

Chien-Shou Liao, New Taipei, TW;

Chih-Wei Yu, Taipei, TW;

Assignee:

ASTI GLOBAL INC., TAIWAN, Changhua County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/0622 (2014.01); B23K 26/03 (2006.01); B23K 26/082 (2014.01); B23K 26/16 (2006.01); B23K 26/70 (2014.01); B23K 26/142 (2014.01); H01L 21/67 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0624 (2015.10); B23K 26/032 (2013.01); B23K 26/082 (2015.10); B23K 26/0821 (2015.10); B23K 26/142 (2015.10); B23K 26/16 (2013.01); B23K 26/707 (2015.10); B23K 2101/40 (2018.08); H01L 21/67092 (2013.01);
Abstract

A cutting device for a thin semiconductor wafer includes a laser light generator and a polygonal mirror structure. The laser light generator is used to provide a femtosecond laser light with a pulse width on a femtosecond order (10second). The polygonal mirror structure is used to reflect the femtosecond laser light. The polygonal mirror structure has a plurality of reflective surfaces. The polygonal mirror structure rotates continuously with respect to the femtosecond laser light, such that the femtosecond laser light is sequentially and repeatedly reflected by the plurality of reflective surfaces and projected on a semiconductor wafer. The femtosecond laser light projected on a semiconductor wafer moves repeatedly along a same predetermined direction in a predetermined range during a predetermined time to groove or cut the semiconductor wafer.


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