The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Sep. 11, 2017
Applicant:

Illumina, Inc., San Diego, CA (US);

Inventors:

Hui Han, San Diego, CA (US);

Dajun A. Yuan, San Diego, CA (US);

M. Shane Bowen, Encinitas, CA (US);

Assignee:

Illumina, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); B29C 65/16 (2006.01); B29C 65/14 (2006.01); H01J 37/32 (2006.01); B32B 17/06 (2006.01); G03F 7/038 (2006.01); G03F 7/00 (2006.01); B81C 1/00 (2006.01); G03F 7/30 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502707 (2013.01); B29C 65/1406 (2013.01); B29C 65/1612 (2013.01); B32B 17/064 (2013.01); B81C 1/0038 (2013.01); G03F 7/0002 (2013.01); G03F 7/038 (2013.01); H01J 37/32009 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0877 (2013.01); B01L 2300/0887 (2013.01); B01L 2300/0896 (2013.01); B81C 2201/0153 (2013.01); G03F 7/16 (2013.01); G03F 7/2002 (2013.01); G03F 7/30 (2013.01); H01J 2237/3341 (2013.01);
Abstract

Imprinted substrates are often used to produce miniaturized devices for use in electrical, optic and biochemical applications. Imprinting techniques, such as nanoimprinting lithography, may leave residues in the surface of substrates that affect bonding and decrease the quality of the produced devices. An imprinted substrate with residue-free region, or regions with a reduced amount of residue for improved bonding quality is introduced. Methods to produce imprinted substrates without residues from the imprinting process are also introduced. Methods include physical exclusion methods, selective etching methods and energy application methods. These methods may produce residue-free regions in the surface of the substrate that can be used to produce higher strength bonding.


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