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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11019759 B1

PDFFull Text
Date of Patent:
May. 25, 2021

Filed:

Dec. 01, 2016

Electromagnetic wave shielding material

Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventor:

Koichiro Tanaka, Ibaraki, JP;

Assignee:

JX Nippon Mining & Metals Corporation, Tokyo, JP;

Attorney:

Marshall, Gerstein & Borun LLP

Primary Examiner:

Elizabeth E Mulvaney

Int. Cl.
CPC ...
B32B 3/00 (2006.01); H05K 9/00 (2006.01); B32B 7/025 (2019.01); B32B 15/08 (2006.01); B32B 15/085 (2006.01); B32B 15/088 (2006.01); B32B 15/095 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0088 (2013.01); B32B 7/025 (2019.01); B32B 15/08 (2013.01); B32B 15/085 (2013.01); B32B 15/088 (2013.01); B32B 15/095 (2013.01); B32B 15/20 (2013.01); B32B 2250/40 (2013.01); B32B 2250/42 (2013.01); B32B 2307/202 (2013.01); B32B 2307/212 (2013.01); B32B 2307/732 (2013.01); B32B 2457/00 (2013.01); B32B 2605/08 (2013.01);
Abstract

Provided is an electromagnetic shielding material that has good magnetic field shielding properties against a low-frequency electromagnetic field of 1 MHz or less, lightweight and also excellent formability. The electromagnetic shielding material has a structure in which at least two metal foils are closely laminated via at least one resin layer, wherein at least one resin forming the at least one resin layer has no yield point at 150° C.; wherein all of combinations of the at least two metal foils and the at least one resin layer forming the electromagnetic shielding material satisfy the following equation (A):σ≥3×10,  Equation (A):

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Tanaka, Koichiro. (2021). Electromagnetic wave shielding material (U.S. Patent No. 11019759). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11019759

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