The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Apr. 20, 2017
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Naoya Hashii, Tokyo, JP;

Yoshifumi Mizuno, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 7/14 (2006.01); H02M 7/48 (2007.01); H01L 23/42 (2006.01); H01L 23/40 (2006.01); H01L 25/07 (2006.01); H02M 7/00 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20927 (2013.01); H01L 23/4006 (2013.01); H01L 23/42 (2013.01); H01L 25/072 (2013.01); H02M 7/003 (2013.01); H02M 7/48 (2013.01); H05K 7/1432 (2013.01); H05K 7/2039 (2013.01); H01L 23/473 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4087 (2013.01);
Abstract

Provided is a power conversion device including: power semiconductor elements, a support case, a heat sink, in which a plurality of boss portions are formed; a smoothing capacitor including a case member having a plurality of leg portions; and a bus bar configured to connect the smoothing capacitor and the DC input terminal, wherein, in the power conversion device in which the plurality of leg portions of the case member being respectively fixed to the plurality of boss portions of the heat sink, wherein materials and dimensions of the respective boss portions, the respective leg portions, the support case, and the bus bar are determined so that a total thermal expansion/contraction amount of the respective boss portions and the respective leg portions falls within a range of 0.9 to 1.1 relative to a total thermal expansion/contraction amount of the support case and the bus bar.


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