The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Oct. 30, 2019
Applicant:

Brigham Young University, Provo, UT (US);

Inventors:

Robert Davis, Provo, UT (US);

Nick Morrill, Provo, UT (US);

David Miller, Morgan, UT (US);

Assignee:

Tula Health, Inc., Kaysville, UT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 3/18 (2006.01); H05K 3/00 (2006.01); H01L 51/00 (2006.01); B81C 1/00 (2006.01); B82Y 40/00 (2011.01); C01B 32/168 (2017.01); C01B 32/162 (2017.01); A61B 5/053 (2021.01); A61B 5/0531 (2021.01);
U.S. Cl.
CPC ...
H05K 3/4644 (2013.01); B81C 1/00484 (2013.01); B81C 1/00531 (2013.01); B81C 1/00539 (2013.01); B81C 1/00682 (2013.01); B81C 1/00904 (2013.01); B82Y 40/00 (2013.01); C01B 32/162 (2017.08); C01B 32/168 (2017.08); H01L 51/003 (2013.01); H01L 51/0012 (2013.01); H01L 51/0045 (2013.01); H05K 3/0011 (2013.01); H05K 3/18 (2013.01); A61B 5/053 (2013.01); A61B 5/0531 (2013.01); B81C 2201/0187 (2013.01); H01L 51/0022 (2013.01); H01L 51/0023 (2013.01); H01L 2221/1094 (2013.01); Y10S 977/742 (2013.01); Y10S 977/842 (2013.01); Y10S 977/925 (2013.01);
Abstract

A method, system, apparatus, and/or device to creating a set of miniaturized electrode pillars. The method, system, apparatus, and/or device may include patterning a set of miniaturized electrode pillars on a substrate and coating the set of miniaturized electrode pillars with an interstitial filler disposed between the set of miniaturized electrode pillars. The interstitial filler may insulate the set of miniaturized electrode pillars from each other and bolster the set of miniaturized electrode pillars.


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