The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Jan. 12, 2018
Device having a substrate configured to be thermoformed coupled to an electrically conductive member
Applicant:
Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;
Inventor:
Mohammed Benwadih, Champagny sur Marne, FR;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); B29C 51/10 (2006.01); B29C 51/14 (2006.01); B29C 51/42 (2006.01); H05K 3/12 (2006.01); B29K 105/00 (2006.01); B29L 9/00 (2006.01); B29L 31/34 (2006.01); H01Q 1/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/10 (2013.01); B29C 51/10 (2013.01); B29C 51/14 (2013.01); B29C 51/421 (2013.01); H05K 1/092 (2013.01); H05K 3/0014 (2013.01); B29K 2105/256 (2013.01); B29K 2995/0005 (2013.01); B29L 2009/005 (2013.01); B29L 2031/3456 (2013.01); H01Q 1/38 (2013.01); H05K 3/1283 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/026 (2013.01); H05K 2201/0272 (2013.01); H05K 2201/09218 (2013.01); H05K 2201/10098 (2013.01); H05K 2203/0425 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1121 (2013.01);
Abstract
The device intended to be thermoformed comprises a substrate capable of being thermoformed and an electrically conductive member integral with the said substrate. The electrically conductive member comprises: electrically conductive particles, an electrically conductive material, electrically conductive elements of elongated shape. The electrically conductive material has a melting point which is strictly less than the melting point of the electrically conductive particles and than the melting point of the elements of elongated shape.