The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Jan. 24, 2019
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Masashi Matsubara, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); B28B 11/14 (2006.01); B28B 11/24 (2006.01); B28B 17/00 (2006.01); B32B 18/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0052 (2013.01); B28B 11/14 (2013.01); B28B 11/243 (2013.01); B28B 17/0018 (2013.01); B32B 18/00 (2013.01); H05K 1/0298 (2013.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/007 (2013.01); H05K 3/303 (2013.01); H05K 3/4644 (2013.01); C04B 2237/64 (2013.01); C04B 2237/68 (2013.01); H01L 2224/97 (2013.01); H05K 3/4629 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2203/0228 (2013.01);
Abstract

In a method for manufacturing ceramic substrates and module components, an unfired mother ceramic substrate is cut at predetermined positions for division into separate unfired ceramic substrates. The cut unfired mother ceramic substrate is pressed such that pressure is applied parallel or substantially parallel to its main surfaces so that the cross-sectional end surfaces created in the cutting step are joined. The unfired mother ceramic substrate including end surface junctions, resulting from joining of the cross-sectional end surfaces, is fired. The fired mother ceramic substrate is broken along the end surface junctions to divide it into separate ceramic substrates.


Find Patent Forward Citations

Loading…