The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Sep. 05, 2019
Applicant:
Hannstouch Solution Incorporated, Tainan, TW;
Inventor:
Chien-Chih Hsiao, Tainan, TW;
Assignee:
HannsTouch Solution Incorporated, Tainan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/76 (2006.01); H01L 51/56 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); B32B 43/00 (2006.01); H01L 51/00 (2006.01); B29L 31/34 (2006.01); B32B 37/26 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); B29C 65/76 (2013.01); B32B 43/006 (2013.01); H01L 51/003 (2013.01); H01L 51/0024 (2013.01); H01L 51/0097 (2013.01); H01L 51/56 (2013.01); H05K 1/0281 (2013.01); H05K 3/4673 (2013.01); B29L 2031/3425 (2013.01); B29L 2031/3475 (2013.01); B32B 2037/268 (2013.01); B32B 2457/08 (2013.01); B32B 2457/206 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/56 (2013.01); H05K 2201/05 (2013.01);
Abstract
A flexible electronic device is disclosed and includes a first flexible substrate, a stress compensation adhesive layer, a second flexible substrate, and an element layer. The stress compensation adhesive layer is disposed on the first flexible substrate. The second flexible substrate is disposed on the stress compensation adhesive layer, in which the second flexible substrate is adhered to the first flexible substrate through stress compensation adhesive layer. The element layer is disposed on the second flexible substrate.