The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
May. 06, 2019
Red E Innovations, Llc, Troy, MI (US);
Jeremy Samkowiak, Prudenville, MI (US);
James P Stuart, Bloomfield Hills, MI (US);
Peter Chan, Lily Lake, IL (US);
Red E Innovations, LLC, Troy, MI (US);
Abstract
An intelligent monitor system for monitoring an injection mold or stamping die includes sensors, logic and communication paths for improving usability and reliability during monitoring. In one aspect, a monitor can be configured to not only monitor a production cycle count and/or cycle time of an injection mold or stamping die, but also analyze operations of the injection mold or stamping die to adapt to the system. The monitor can analyze, for example, temperatures, pressures, vibrations, location, and/or flow control, among other things, at various points, with flexibility for adding additional monitoring on the fly, to adapt various functions, such as reporting frequency, communication method, power conservation, and the like. The monitor can utilize multiple radios for communicating with a data center, including but not limited to, via relays and/or gateways, to ensure reliable operation. The monitor can also utilize multiple power sources, with circuitry for selectively bypassing unused power sources, for maximum power efficiency.