The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Dec. 21, 2017
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka, JP;

Inventors:

Mieko Ishii, Tokyo, JP;

Atsushi Kazama, Tokyo, JP;

Seiichi Katou, Tokyo, JP;

Kengo Suzuki, Tokyo, JP;

Hidenori Shinohara, Hitachinaka, JP;

Hiroaki Nagai, Hitachinaka, JP;

Kenichi Takeuchi, Hitachinaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 13/239 (2018.01); H04N 5/225 (2006.01); H05K 7/20 (2006.01); B60R 1/00 (2006.01); H01L 23/40 (2006.01); H01L 23/467 (2006.01); G03B 15/00 (2021.01); G03B 17/02 (2021.01); G03B 17/55 (2021.01);
U.S. Cl.
CPC ...
H04N 13/239 (2018.05); H04N 5/2252 (2013.01); H04N 5/2258 (2013.01); H05K 7/2039 (2013.01);
Abstract

The present invention provides a highly reliable stereo camera in which it is possible to prevent the heat generated by an image processing element from contributing to an increase in the temperature of an image sensor, even if the stereo camera is made more compact and the heat density is thus increased inside the stereo camera. The present invention includes: a pair of image sensorsthat have respective imaging elements disposed at the same height with a space therebetween; image processing elementsthat are disposed between the image sensors and process image signals captured by the image sensors; a casingthat has the image processing elements and the image sensors incorporated therein, and in the area between the image sensors, has an inclined surface that is inclined from the image sensorsdownward toward the imaging direction of the image sensors; an airflow paththat is defined so as to extend along the inclined surface of the casingtoward the imaging direction; and heat dissipating partsthat are thermally connected to the respective image processing elementsand disposed on the inclined surface so as to face the airflow path.


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