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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11018404 B1

PDFFull Text
Date of Patent:
May. 25, 2021

Filed:

Aug. 17, 2016

Circuit body structure, where planar conductors on different layers of a multilayer board are connected by an interlayers connection

Applicant:

Nec Space Technologies, Ltd., Tokyo, JP;

Inventor:

Osamu Amano, Tokyo, JP;

Assignee:

NEC SPACE TECHNOLOGIES, LTD., Tokyo, JP;

Attorney:
Primary Examiner:

Benny T Lee

Int. Cl.
CPC ...
H01P 5/02 (2006.01); G01R 1/04 (2006.01); H01P 3/08 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01P 5/028 (2013.01); G01R 1/0441 (2013.01); H01P 3/085 (2013.01); H01P 3/088 (2013.01); H05K 1/02 (2013.01); H05K 3/46 (2013.01);
Abstract

Provided is a circuit structural body is formed into a shape including: A circuit structural body, including: a multilayer board, which includes a plurality of layers of a first to N-th tri-plate structural bodies each including a first to N-th (N is an integer of 2 or more) planar conductors; an interlayers connection conductor, which is configured to connect the first to N-th planar conductors to each other; and a side-surface ground conductor, which is formed on a side surface of the multilayer board, and is approximately parallel to and near the interlayers connection conductor.

Find Patent Forward Citations

Amano, Osamu. (2021). Circuit body structure, where planar conductors on different layers of a multilayer board are connected by an interlayers connection (U.S. Patent No. 11018404). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11018404

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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