The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Sep. 17, 2019
Applicant:
Nichia Corporation, Anan, JP;
Inventors:
Tomohiro Ikeda, Komatsushima, JP;
Masaaki Katsumata, Anan, JP;
Yohei Inayoshi, Komatsushima, JP;
Yosuke Nakayama, Komatsushima, JP;
Yumiko Kameshima, Anan, JP;
Assignee:
NICHSA CORPORATION, Anan, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 33/64 (2010.01); H01L 25/075 (2006.01); H05K 3/00 (2006.01); H05K 1/18 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/647 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 33/64 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2933/0075 (2013.01); H05K 1/189 (2013.01); H05K 3/0061 (2013.01); H05K 2201/10106 (2013.01);
Abstract
A metal-base substrate includes a metal plate, an adhesive layer; and a film substrate. The adhesive layer is interposed between the metal plate and the film substrate. The film substrate has a wiring layer on a first surface opposite to a second surface on which the adhesive layer is arranged, with a through hole piercing through the film substrate in a thickness direction of the film substrate.