The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Sep. 19, 2019
Nanya Technology Corporation, New Taipei, TW;
Chien-Chung Wang, New Taipei, TW;
Hsih-Yang Chiu, Taoyuan, TW;
NANYA TECHNOLOGY CORPORATION, New Taipei, TW;
Abstract
An integrated circuit structure includes a substrate, a metal pad, a first passivation layer, a second passivation layer, and a conductive bump. The metal pad is over the substrate. The metal pad includes a probing portion and a bumping portion laterally connected to the probing region. The first passivation layer is over the metal pad. The second passivation layer is over the first passivation layer and has an opening. The bumping portion is in the opening. The conductive bump is in the opening of the second passivation layer and contacts the probing portion. The probing portion and the conductive bump are separated by the first passivation layer.