The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Mar. 17, 2017
Agency for Science, Technology and Research, Singapore, SG;
Roshan Weerasekera, Singapore, SG;
Surya Bhattacharya, Singapore, SG;
Ka Fai Chang, Singapore, SG;
Vempati Srinivasa Rao, Singapore, SG;
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH, Singapore, SG;
Abstract
Various embodiments may provide a semiconductor package. The semiconductor package may include a routing layer including a plurality of first layer contact elements on a first side and a plurality of second layer contact elements on a second side opposite the first side, and a first semiconductor die including a plurality of first electrical die contact elements coupled to the plurality of first layer contact elements. The semiconductor package may further include a second semiconductor die including a plurality of second electrical die contact elements coupled to the plurality of second layer contact elements, and a mold structure covering the second semiconductor die. A first pitch between neighbouring first electrical die contact elements may be greater than a second pitch between neighbouring second electrical die contact elements.