The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
May. 31, 2018
Samsung Electronics Co., Ltd., Suwon-si, KR;
Ji Youn Seo, Seoul, KR;
Byung Sun Park, Suwon-si, KR;
Sung Jin Park, Seongnam-si, KR;
Ji Woon Im, Hwaseong-si, KR;
Hyun Seok Lim, Suwon-si, KR;
Byung Ho Chun, Seongnam-si, KR;
Yu Seon Kang, Hwaseong-si, KR;
Hyuk Ho Kwon, Hwaseong-si, KR;
Tae Yong Eom, Anyang-si, KR;
Dae Hun Choi, Hwaseong-si, KR;
Dong Hyeop Ha, Daegu, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A deposition apparatus for depositing a material on a wafer, the apparatus including a lower shower head; an upper shower head disposed on the lower shower head, the upper shower head facing the lower shower head; and a support structure between the upper shower head and the lower shower head, the wafer being supportable by the support structure, wherein the upper shower head includes upper holes for providing an upper gas onto the wafer, the lower shower head includes lower holes for providing a lower gas onto the wafer, the support structure includes a ring body surrounding the wafer; a plurality of ring support shafts between the ring body and the lower shower head; and a plurality of wafer supports extending inwardly from a lower region of the ring body to support the wafer, and the plurality of wafer supports are spaced apart from one another.