The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Jun. 01, 2017
Mitsubishi Electric Corporation, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A method of manufacturing a semiconductor device according to the present invention includes a step of forming an opening portion in a resist coated on a substrate, a step of coating a thermally-shrinking shrink agent on the resist to fill the opening portion with the shrink agent, a shrinking step of heating and thermally shrinking the shrink agent to reduce a width of the opening portion, a removing step of removing the shrink agent after the shrinking step, a step of forming a metal layer on the resist and in the opening portion after the removing step and a step of removing a portion of the metal layer above the resist and the resist, wherein in the shrinking step, a side surface of the resist forming the opening portion forms a curved surface protruding toward a center portion of the opening portion.