The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Dec. 19, 2018
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventors:
Assignee:
Industrial Technology Research Institute, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/027 (2006.01); G03F 7/033 (2006.01); G03F 7/085 (2006.01); G03F 7/004 (2006.01); C09J 4/00 (2006.01); C09J 165/04 (2006.01); G03F 7/032 (2006.01); G03F 7/021 (2006.01); C08K 3/38 (2006.01); C08K 3/28 (2006.01); C08F 16/32 (2006.01); C08G 61/04 (2006.01); C08K 3/14 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0043 (2013.01); C09J 4/00 (2013.01); C09J 165/04 (2013.01); G03F 7/0045 (2013.01); G03F 7/027 (2013.01); G03F 7/0212 (2013.01); G03F 7/032 (2013.01); G03F 7/033 (2013.01); G03F 7/085 (2013.01); C08F 16/32 (2013.01); C08G 61/04 (2013.01); C08G 2261/143 (2013.01); C08K 3/14 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/38 (2013.01); C08K 2003/282 (2013.01); C08K 2003/382 (2013.01); C08K 2201/001 (2013.01); C08L 2203/20 (2013.01);
Abstract
The disclosure provides a photosensitive adhesive composition including 10 parts by weight to 90 parts by weight of a monomer having a vinyl ether functional group, 10 parts by weight to 90 parts by weight of a tertiary amine polymer, and 0.5 parts by weight to 10 parts by weight of a photoacid initiator. The weight-average molecular weight of the tertiary amine polymer is between 2000 and 20000. The disclosure also provides a photosensitive conductive adhesive composition and an electronic device containing the photosensitive conductive adhesive composition.