The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Oct. 23, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Daniel J. Buvid, Rochester, MN (US);

Eric J. Campbell, Rochester, MN (US);

Sarah K. Czaplewski, Rochester, MN (US);

Christopher W. Steffen, Rochester, MN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/44 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); G02B 6/02 (2006.01); H01B 13/016 (2006.01); H05K 3/00 (2006.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4416 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); G02B 6/02033 (2013.01); H01B 13/016 (2013.01); H01L 21/486 (2013.01); H01L 21/56 (2013.01); H01L 23/49827 (2013.01); H01L 23/49894 (2013.01); H05K 3/0014 (2013.01); G02B 6/4274 (2013.01); G02B 6/43 (2013.01); H01L 23/49816 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01); Y10T 29/49123 (2015.01);
Abstract

A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.


Find Patent Forward Citations

Loading…